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Future Designs, Inc.
Future Designs, Inc.
Future Designs, Inc. is a full service design and production company with hardware, software, mechanical and system level expertise and a 25 year history of proven success. Our ELI? and uEZ? GUI Family of products for Touch Screen LCD GUI and HMI applications provide “Off The Shelf” solutions that allows customers to quickly and cost effectively upgrade their User Interfaces. Products are available with LCD’s from 3.5” to 15.0”, resistive touch and PCAP options. FDI can take your concept all the way from the back of a napkin, through design and prototypes, to high volume production, branded with your logo and shipped directly to your end customers.
Picture | Model/Brand/Encapsulation/Describe | RoHS | Price | Quantity | Operate |
|---|---|---|---|---|---|
 |  | 1+:$237.5 | Total： $237.500000 | ||
 | Model： SOMDIMM-RX62N Catalog： Evaluation Boards - Embedded - MCU, DSP Encapsulation： Describe： Data sheet | | 10+:$47.5 | Total： $475.000000 | |
 | | 1+:$237.5 | Total： $237.500000 | ||
 | Model： SOMDIMM-LPC2478 Catalog： Evaluation Boards - Embedded - MCU, DSP Encapsulation： Describe： Data sheet | | 5+:$45 | Total： $225.000000 | |
 | Model： SOMDIMM-LPC1788 Catalog： Evaluation Boards - Embedded - MCU, DSP Encapsulation： Describe： Data sheet | | 1+:$45 | Total： $45.000000 | |
 | Model： SYG-S7G2-SOM Catalog： Evaluation Boards - Embedded - MCU, DSP Encapsulation： Describe： Data sheet | | 1+:$75 | Total： $75.000000 | |
 | Model： SYG-S7G2-43C-MDK Catalog： Evaluation Boards - Embedded - MCU, DSP Encapsulation： Describe： Data sheet | | 1+:$184.5 | Total： $184.500000 | |
 | Model： SOMDIMM-RX63N Catalog： Microcontrollers, Microprocessor, FPGA Modules Encapsulation： Describe： Data sheet | | 5+:$52.5 | Total： $262.500000 | |
 | | 10+:$82.5 | Total： $825.000000 | ||
 | | 10+:$19.5 | Total： $195.000000 |
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