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Samsung
As the memory industry leader for more than two decades, Samsung has continued pioneering milestone DRAM technologies since the early 1980s. Samsung’s leading-edge DRAM solutions are widely used in today’s most up-to-date digital devices, based on the solutions’ industry-leading performance, density and energy-efficiency. Samsung has been providing the industry’s first DRAM solutions based on 10nm-class process and HBM memory for use in applications ranging from High-Performance Computing (HPC), advanced graphics and network systems, next-generation datacenters, enterprise servers and artificial intelligence that deal with data-intensive applications including real-time analytics, high-frequency trading and artificial intelligence. Samsung has been an innovator in flash memory technologies, offering a host of high-performance, high-density, high-reliability data storage solutions for use in PCs, enterprise storage, mobile devices, branded SSDs and external memory cards. Since 2013, Samsung’s industry-first 3D V-NAND technology has overcome the challenges posed for former data storage devices and secured optimal performance, density and reliability. In particular, Samsung’s V-NAND SSDs offer unprecedented scalability that will continue to address the ever-increasing needs for data processing and storage systems. Samsung's Exynos family, a line-up of mobile processors, is designed to power the devices of today across the IT landscape, from premium mobile devices to automotive and IoT applications. Available with the industry’s most advanced process technologies, as well as the latest multi-mode modem and connectivity solutions for 2G to 5G, Samsung’s flagship processors bring outstanding performance and power efficiency to meet a wide range of requirements of today’s smart and connected devices. Through advanced mobile imaging technologies, Samsung’s ISOCELL image sensors enable DSLR-level photography experiences with excellent color and brightness, fast auto focus and diverse dual-camera solutions on today’s mobile devices. Samsung’s image sensors, when used for automotive applications, also offer safer driving experiences with clearer views and more accurate object detection.
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Price
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K4B4G0846E-BYMA FBGA-96 Pre-ordered Chips ROHS
Category:Pre-ordered Chips
Manufacturer:SAMSUNG(三星半导体)
Package:FBGA-96
Packaging:Tray
K4F6E304HB-MGCJ K4F6E304HB-MGCJ
Category:Pre-ordered Products
Manufacturer:SAMSUNG(三星半导体)
Package:SMD
Packaging:Pallet
KMFN60012B-B214 SMD Pre-ordered Products ROHS
Category:Pre-ordered Products
Manufacturer:SAMSUNG(三星半导体)
Package:SMD
Packaging:Tray
KMDH6001DA-B422 SMD Pre-ordered Products ROHS
Category:Pre-ordered Products
Manufacturer:SAMSUNG(三星半导体)
Package:SMD
Packaging:Tray
K9F2G08U0D-SIB0 K9F2G08U0D-SIB0
Category:Pre-ordered Products
Manufacturer:SAMSUNG(三星半导体)
Package:TSOP
Packaging:Tape
M471A2K43CB1-CPB - Pre-ordered Products ROHS
Category:Pre-ordered Products
Manufacturer:SAMSUNG(三星半导体)
Package:-
Packaging:Reel
M471A2K43DB1-CWE - Pre-ordered Products ROHS
Category:Pre-ordered Products
Manufacturer:SAMSUNG(三星半导体)
Package:-
Packaging:Reel
M471A5244CB0-CRC - Pre-ordered Products ROHS
Category:Pre-ordered Products
Manufacturer:SAMSUNG(三星半导体)
Package:-
Packaging:Reel
M474A1K43DB1-CWE M474A1K43DB1-CWE
Category:Pre-ordered Products
Manufacturer:SAMSUNG(三星半导体)
Package:-
Packaging:Tape
MZ7KH240HAHQ MZ7KH240HAHQ
Category:Pre-ordered Products
Manufacturer:SAMSUNG(三星半导体)
Package:-
Packaging:Tape
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