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Manufacturer
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  • Infineon Technologies
  • TE Connectivity
  • NDST
  • XSD
  • Made in China
  • Aavid
Package
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  • e-eupec-0
  • 100g
  • -
  • 200x400x0.5mm
  • 200x400x1.5mm
  • 200x400x1mm
  • 200x400x2mm
  • 200x400x3mm
  • 200x400x4mm
  • 200x400x5mm
  • 40x40x11mm
  • 15*10.5*21
  • 28x28x11mm
  • 28x28x5.6mm
  • 60*11*20
  • 11*5*7
  • 14.6x6x20mm
  • 14x14x10mm
  • 14x14x6mm
  • 15*10*20
  • 15*10.5*24
  • 15*15*25
  • 15x15x10mm
  • 16.5x16x25mm
  • 16x16x10mm
  • 18*6*14
  • 18*8*17
  • 19*13.6*10.1
  • 19*5*18
  • 19.30mmx13.97mm
  • 20*10*20
  • 20*15*20
  • 20x10x12mm
  • 20x14x20mm
  • 20x15x40mm
  • 20x20x10mm
  • 20x20x15.3mm
  • 20x20x6.3mm
  • 22*10*22
  • 22*10*25
  • 22*22*10mm
  • 22.5*6*20
  • 22x22x10mm
  • 23.24mmx18.8mm
  • 23.5*16*25
  • 23x16x20mm
  • 23x23x10mm
  • 24*10*100
  • 24*10*25
  • 25*15*25
Packaging
Please Input
  • bag
  • pallet
  • box
  • tray
Images
Mfr.Part #
Category/Manufacturer/Package/Packaging
RoHS
Price
Quantity
Operate
C13380 TO-220(TO-220-3) Heat Sinks ROHS
Category:Heat Sinks
Manufacturer:Made in China
Package:TO-220(TO-220-3)
Packaging:Bag
15*10.5*21 H型散热片 15*10.5*21 Heat Sinks ROHS
Category:Heat Sinks
Manufacturer:XSD
Package:15*10.5*21
Packaging:Bag
15*10.5*21H型散热块(黑色) 15*10.5*21H型散热块(黑色)
Category:Heat Sinks
Manufacturer:XSD
Package:15*10.5*21
Packaging:Bag
C108928 C108928
Category:Heat Sinks
Manufacturer:XSD
Package:15*10.5*24
Packaging:Bag
23.5*16*25 2个钉散热片 23.5*16*25 2个钉散热片
Category:Heat Sinks
Manufacturer:XSD
Package:23.5*16*25
Packaging:Bag
15*10*20 U型散热板 白色 15*10*20 U型散热板 白色
Category:Heat Sinks
Manufacturer:XSD
Package:15*10*20
Packaging:Bag
23X16X20mm 23X16X20mm
Category:Heat Sinks
Manufacturer:XSD
Package:23X16X20mm
Packaging:Bag
XSD309-067 16.5x16x25mm Heat Sinks ROHS
Category:Heat Sinks
Manufacturer:XSD
Package:16.5x16x25mm
Packaging:Bag
C32487 C32487
Category:Heat Sinks
Manufacturer:XSD
Package:P=23mm
Packaging:Bag
11*5*7 散热板 11*5*7 散热板
Category:Heat Sinks
Manufacturer:XSD
Package:11*5*7
Packaging:Bag
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Heat SinksA heat sink is a device that is used to dissipate heat from an electronic or mechanical component or system. It typically consists of a metal or composite material with a large surface area and a high thermal conductivity, which allows it to absorb and dissipate heat efficiently. Heat sinks are commonly used in electronic devices and systems to prevent overheating and improve performance. They are often attached to components such as CPUs, GPUs, and power amplifiers, which generate a significant amount of heat during operation. Heat sinks can also be used in mechanical systems to dissipate heat from friction or other sources. In addition to their thermal conductivity, the shape and design of heat sinks can also affect their performance. For example, a heat sink with fins can provide a larger surface area for heat dissipation than a smooth surface, allowing it to dissipate heat more efficiently.