Manufacturer
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- MK
- FORESEE
Package
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- bga
- bga-162
Packaging
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- pallet
- tray
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | FS702B2R1DH2A2KDE BGA-162 Memory - Serial MCP (Multi Chip Package) ROHS | Category：Memory - Serial MCP (Multi Chip Package) Manufacturer：FORESEE Package：BGA-162 Packaging：Tray |  | |||
| MKM04EL04TD2-TN MKM04EL04TD2-TN | Category：Memory - Serial MCP (Multi Chip Package) Manufacturer：MK Package：BGA Packaging：Pallet | |
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Memory - Serial MCP (Multi Chip Package)A serial multi-chip package (MCP) is a type of memory module that contains multiple memory chips that are interconnected using a serial interface. Serial MCPs are commonly used in electronic devices, such as smartphones and other consumer electronics, where space and power consumption are critical considerations.
A serial MCP typically consists of multiple memory chips, such as DRAM or NAND flash memory, that are mounted on a small circuit board and connected together using a serial interface, such as I2C or SPI. The serial interface allows the memory chips to be accessed and controlled using a single bus, which reduces the number of connections and simplifies the circuit design.
Serial MCPs are an attractive option for many electronic devices because they provide a compact and low-power solution for memory. They are typically used in applications where the memory needs to be accessed frequently and where space is limited, such as in smartphones, tablets, and other portable electronic devices.
