Search History
000Manufacturer
Please Input
- ZDAUTO
- ZLG Zhiyuan Elec
- VISOM
- WIER
- Guangzhou Dtech Elec Tech
- MORNSUN Guangzhou S& T
- Taisko
- Z-TEK
- Jixin
Package
Please Input
- dip
- -
- dip-7
- module
- through hole
- 21mmx12.5mmx5mm
- dip-12
- plugin
Packaging
Please Input
- tube
- box
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | M5S-CXUSBE3 M5S-CXUSBE3 | Category：RS232 Bus Modules Manufacturer：ZDAUTO Package：21mmx12.5mmx5mm Packaging：Tube |  | |||
| RSM232 RSM232 | Category：RS232 Bus Modules Manufacturer：Taisko Package：Through Hole Packaging：Tube | | |||
| TD501D232H TD501D232H | Category：RS232 Bus Modules Manufacturer：VISOM Package：DIP Packaging：Tube | | |||
| TD502D232H TD502D232H | Category：RS232 Bus Modules Manufacturer：VISOM Package：DIP Packaging：Tube | | |||
| TD301D232H DIP RS232 Bus Modules ROHS | Category：RS232 Bus Modules Manufacturer：VISOM Package：DIP Packaging：Tube | | |||
| JX070101 JX070101 | Category：RS232 Bus Modules Manufacturer：Jixin Package：Module Packaging：Box | | |||
| RSM232 Module RS232 Bus Modules ROHS | Category：RS232 Bus Modules Manufacturer：ZLG Zhiyuan Elec Package：Module Packaging：Tube | | |||
| RSM232 RSM232 | Category：RS232 Bus Modules Manufacturer：VISOM Package：DIP Packaging：Tube | | |||
| TD501D232H TD501D232H | Category：RS232 Bus Modules Manufacturer：MORNSUN Guangzhou S& T Package：DIP-7 Packaging：Tube | | |||
| RSM232D Through Hole RS232 Bus Modules ROHS | Category：RS232 Bus Modules Manufacturer：Taisko Package：Through Hole Packaging：Tube | |
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RS232 Bus ModulesThe RS232 bus is a type of serial bus used for communication between devices. It is a widely used standard that allows devices to exchange data and control signals over a single communication channel. RS232 bus modules are devices that provide a physical interface between a device and an RS232 bus, allowing the device to communicate with other devices on the bus. These modules typically have a connector for the RS232 bus, as well as a connector or interface for the device that is being connected to the bus. They may also have additional features, such as built-in buffers or signal conditioning circuits, to improve the performance of the bus and the connected devices.
