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126252FLATTENED, COPPER HEATPIPE, SINT
Category:Thermal - Heat Pipes, Vapor Chambers
Manufacturer:Wakefield Thermal
Package:
Packaging:
1+ :$7.08
10+ :$6.6875
25+ :$6.2944
50+ :$5.9009
100+ :$5.50755
250+ :$5.11414
500+ :$5.01579
1000+ :$4.91744
Unit Price: $ 7.08
Total: $ 7.0800

126694FLATTENED, COPPER HEATPIPE, SINT
Category:Thermal - Heat Pipes, Vapor Chambers
Manufacturer:Wakefield Thermal
Package:
Packaging:
1+ :$7.59
10+ :$7.1685
25+ :$6.7468
50+ :$6.3251
100+ :$5.90345
250+ :$5.48178
500+ :$5.37636
1000+ :$5.27094
Unit Price: $ 7.59
Total: $ 7.5900

126484FLATTENED, COPPER HEATPIPE, SINT
Category:Thermal - Heat Pipes, Vapor Chambers
Manufacturer:Wakefield Thermal
Package:
Packaging:
1+ :$7.59
10+ :$7.1685
25+ :$6.7468
50+ :$6.3251
100+ :$5.90345
250+ :$5.48178
500+ :$5.37636
1000+ :$5.27094
Unit Price: $ 7.59
Total: $ 7.5900

126670FLATTENED, COPPER HEATPIPE, SINT
Category:Thermal - Heat Pipes, Vapor Chambers
Manufacturer:Wakefield Thermal
Package:
Packaging:
1+ :$7.59
10+ :$7.1685
25+ :$6.7468
50+ :$6.3251
100+ :$5.90345
250+ :$5.48178
500+ :$5.37636
1000+ :$5.27094
Unit Price: $ 7.59
Total: $ 7.5900

126400FLATTENED, COPPER HEATPIPE, SINT
Category:Thermal - Heat Pipes, Vapor Chambers
Manufacturer:Wakefield Thermal
Package:
Packaging:
1+ :$7.59
10+ :$7.1685
25+ :$6.7468
50+ :$6.3251
100+ :$5.90345
250+ :$5.48178
500+ :$5.37636
1000+ :$5.27094
Unit Price: $ 7.59
Total: $ 7.5900

126568FLATTENED, COPPER HEATPIPE, SINT
Category:Thermal - Heat Pipes, Vapor Chambers
Manufacturer:Wakefield Thermal
Package:
Packaging:
1+ :$7.59
10+ :$7.1685
25+ :$6.7468
50+ :$6.3251
100+ :$5.90345
250+ :$5.48178
500+ :$5.37636
1000+ :$5.27094
Unit Price: $ 7.59
Total: $ 7.5900

126442FLATTENED, COPPER HEATPIPE, SINT
Category:Thermal - Heat Pipes, Vapor Chambers
Manufacturer:Wakefield Thermal
Package:
Packaging:
1+ :$7.59
10+ :$7.1685
25+ :$6.7468
50+ :$6.3251
100+ :$5.90345
250+ :$5.48178
500+ :$5.37636
1000+ :$5.27094
Unit Price: $ 7.59
Total: $ 7.5900

126636FLATTENED, COPPER HEATPIPE, SINT
Category:Thermal - Heat Pipes, Vapor Chambers
Manufacturer:Wakefield Thermal
Package:
Packaging:
1+ :$7.59
10+ :$7.1685
25+ :$6.7468
50+ :$6.3251
100+ :$5.90345
250+ :$5.48178
500+ :$5.37636
1000+ :$5.27094
Unit Price: $ 7.59
Total: $ 7.5900

126766FLATTENED, COPPER HEATPIPE, SINT
Category:Thermal - Heat Pipes, Vapor Chambers
Manufacturer:Wakefield Thermal
Package:
Packaging:
1+ :$7.59
10+ :$7.1685
25+ :$6.7468
50+ :$6.3251
100+ :$5.90345
250+ :$5.48178
500+ :$5.37636
1000+ :$5.27094
Unit Price: $ 7.59
Total: $ 7.5900

121721FLATTENED, COPPER HEATPIPE, SINT
Category:Thermal - Heat Pipes, Vapor Chambers
Manufacturer:Wakefield Thermal
Package:
Packaging:
1+ :$7.58
10+ :$7.16
25+ :$6.7388
50+ :$6.3176
100+ :$5.8964
250+ :$5.4752
500+ :$5.36992
1000+ :$5.264625
Unit Price: $ 7.58
Total: $ 7.5800

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Thermal - Heat Pipes, Vapor ChambersFans and thermal management products are used to regulate the temperature of electronic devices and systems. Fans are mechanical devices that use blades to move air or other gases, and are commonly used to cool electronic components by dissipating the heat they generate. Thermal management products, on the other hand, are materials or devices that are used to conduct, dissipate, or otherwise control heat in electronic systems. These products can include things like heatsinks, thermal grease, and thermal interface materials, which are used to improve the heat transfer between components and the surrounding environment. Heat pipes and vapor chambers are two types of thermal management products that are used to conduct heat away from electronic components. Heat pipes are hollow tubes that contain a liquid coolant, which evaporates and condenses as it moves along the length of the tube. This allows the heat pipe to transfer heat from one location to another, effectively moving heat from a hot component to a cooler location where it can be dissipated. Vapor chambers, on the other hand, are flat, plate-like structures that use the same principle of evaporation and condensation to transfer heat. These devices are commonly used in high-performance computer systems and other applications where it is necessary to quickly and efficiently move large amounts of heat.