TSMC's 2nm is expected to be mass-produced in 2025, the industry is optimistic about its leading Samsung and Intel

According to Taiwan media reports, the wafer foundry TSMC's 2nm process will be mass-produced in 2025, and the market is optimistic about the progress and is expected to lead rivals Samsung and Intel.

TSMC's advanced process is progressing smoothly, 3nm will be mass-produced in the second half of this year, and the upgraded 3nm (N3E) process will be mass-produced one year after 3nm mass production, that is, mass production in 2023, and 2nm mass production is expected in 2025. TSMC's 2nm plant will be implemented in the second phase of the Bamboo Branch Baoshan expansion plan. The "Bamboo Branch Administration" has begun construction of public facilities, and TSMC's 2nm plant has also begun ground preparation. TSMC's 2nm is the first to use a nanosheet architecture. Compared with the N3E process, the frequency can be increased by 10% to 15% under the same power consumption. At the same frequency, the power consumption is reduced by 25% to 30%.

TSMC CEO Wei Zhejia emphasized in the technology forum a few days ago that TSMC 2nm will be the technology with the best density and best performance. The market is also optimistic that TSMC's 2nm progress will lead its rivals Samsung and Intel.

According to previous news, although it is slightly conservative in the 3nm generation, in any case, the width of the fin (Fin) is already close to the actual limit, and then it will encounter bottlenecks, so the foreign legal person estimates that TSMC's 2nm advanced process will use wrap-around The gate field effect transistor GAAFET high-end architecture produces 2nm chips.