Siemens Unveils Tessent Multi-die for Advanced Packaging

Recently, Siemens Digital Industries Software, a subsidiary of Siemens, announced its latest innovation in the semiconductor sector. On September 26, the German company unveiled Tessent Multi-die, a new software solution designed to automate the testing design process for chips built with advanced packaging technologies.

As integrated circuit (IC) designs become larger and more complex due to advanced technology nodes, increased model requirements, and higher packaging densities, the complexity of IC testing has also risen significantly.

According to Ankur Gupta, head of Siemens' Tessent division, Siemens collaborates closely with customers to address these growing challenges on a case-by-case basis. He emphasized that testing is a critical part of both chip and substrate manufacturing, and must be embedded into the chip design prior to production.

Gupta also noted that Tessent Multi-die simplifies the testing process for chips utilizing advanced packaging, such as 2.5D and 3D packaging, and will play a key role in accelerating the adoption of next-generation semiconductor technologies.