Siemens introduces Tessent Multi-die to enhance testing of advanced packaging
2022-09-27 09:52:55Mr.Ming
Siemens Digital Industries Software, a subsidiary of Siemens, said today that it has launched a new software called Tessent Multi-die to match and enhance the testing aspects of advanced packaging.
Siemens said IC test complexity has followed a steep rise due to increasing design sizes, advanced technology node and usage model requirements, and rising packaging densities. Siemens has to work with customers on a case-by-case basis, said Ankur Gupta, head of Siemens' Tessent business.
"What we're doing now is taking all this knowledge and automating the solution to make it a common technology for everyone," Gupta told Reuters.
The software also makes the testing process of chips in advanced packaging (2.5D and 3D packaging) easier, he said.
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