TSMC established OIP 3D Fabric alliance, 19 partners including ARM, Micron joined

On October 27, TSMC announced the establishment of the Open Innovation Platform (OIP) 3D Fabric Alliance to promote the development of 3D semiconductors. Currently, 19 partners including Micron, SK Hynix, ASE, ARM, and Synopsys have agreed to join.

It is reported that members of the 3DFabric Alliance can obtain TSMC's 3DFabric technology as early as possible, enabling them to develop and optimize solutions simultaneously with TSMC, and also allow customers to take a leading position in product development, early access from EDA and IP to DCA / VCA, storage, commissioning The highest quality and established solutions and services for Outer Package Test (OSAT), Substrate and Test.

Dr. Lizhong Lu, TSMC Academician/Deputy General Manager of Design and Technology Platform, said: "3D chip stacking and advanced packaging technologies have ushered in a new era of chip-level and system-level innovation, which also requires extensive ecosystem cooperation to assist design People find the best way through a variety of options and approaches. Led by our ecosystem partners, our 3DFabric Alliance provides customers with a simple and flexible way to unleash the power of 3D ICs for their designs, and we can't wait Would love to see the innovation they create with TSMC's 3DFabric technology."

It is understood that TSMC's 3DFabric technology includes front-end 3D chip stacking or TSMC-SoIC (system-on-chip), and back-end technology including CoWoS and InFO series packaging technologies, which can achieve better performance, power consumption, size, appearance and function. , to achieve system-level integration. In addition to the already mass-produced CoWoS and InFO, TSMC will start producing system integration chips in 2022. TSMC currently has the world's first fully automated 3DFabric fab in Zhunan, which integrates advanced testing, TSMC's SoC and InFO operations, providing customers with the best flexibility to optimize with better production cycle time and quality control package.