Organization: 41 new fabs will be added globally in the next three years

According to the Taiwanese media "Economic Daily", statistics from relevant research institutions in Taiwan, China show that the world will set off a wave of fab expansion from 2022 to 2025, or 41 new fabs will be added. Among them, major factories such as TSMC, Samsung and Intel have invested in the expansion of production in the United States, and the total number of new additions in the United States has reached 9 at most.

According to Knometa Research data, there are currently 452 fabs in the world, with 112 in Japan, the second in Taiwan, and the third in the United States and Canada. Among them, the Asian region accounts for nearly 70%, and the 12-inch factories are 41 in Taiwan, 25 in South Korea, 26 in Japan, and 19 in the United States.

Due to the growth of semiconductor application demand and geopolitical factors, it is estimated that from 2022 to 2025, the construction of 41 fabs around the world will start one after another. Data analysis shows that 32 factories are located in Asia and are mainly expanded to 12-inch factories. Taiwan, China is estimated to add 6 factories, including 4 12-inch, 1 8-inch and 1 under 6 inches, Japan is estimated to increase 7 factories including 6 12-inch factories and 1 8-inch factory, and mainland China is estimated to increase 8 factories 12 7 inches and 1 under 6 inches. In addition, the total number of new wafer fabs in the United States is 9, which is the largest increase, including an estimated increase of 8 12-inch fabs and an estimated increase of 1 8-inch fab.

Analysts said that related capacity expansion also produces more carbon emissions, and the semiconductor industry must also improve the problems of high power consumption and high carbon emissions.