Korean manufacturers are actively deploying the FCBGA (commonly known as ABF carrier board) field required for server applications. Among them, Samsung Electro-Mechanics, a subsidiary of Samsung Electronics, announced that it has become the first Korean manufacturer to develop FCBGA for mass field servers and held an exhibition at the Busan factory on November 18. Shipment ceremony and issued a press release stating that the factory produced the highest-end carrier board for the first time.
Samsung Electro-Mechanics issued a press release stating that the substrate market is expected to continue to grow due to demand for high-end products in the industrial and automotive markets, such as 5G antennas, Arm CPUs, and server/automotive/netcom.
In recent years, Samsung Electro-Mechanics has faded out of the HDI field and focused on carrier board investment. Samsung Electro-Mechanics pointed out that the company started the carrier board business in 1991. Last year, it has actively announced a carrier board investment of 1.9 trillion won and plans to cooperate with the group to develop next-generation technology on the carrier board system package (SoS) process.