Samsung Chairman Lee Jae-yong recently revealed the company's mid-to-long-term strategy during a visit to a factory, which includes the development of next-generation semiconductor packaging technology and potential investments in cutting-edge technologies, including chip packaging. Lee emphasized that Samsung should adhere to its investment and talent cultivation plan, which is good news for electronics component distributors, as it means Samsung will actively invest in chip packaging, improving the quality and performance of their products.
Industry experts pointed out that Samsung established a team specifically dedicated to advanced packaging operations at the end of last year to accelerate the development of this technology. However, Samsung faces pressure from TSMC's leading position in chip packaging technology. TSMC established an integrated circuit research and development center dedicated to advanced packaging in Tsukuba, Japan, in July last year. According to TSMC's Liao Tengdui, with advanced packaging and 3D integrated circuit technology, TSMC can package billions of transistors in a single chip and provide new computing capabilities. Therefore, Samsung needs to continue investing in and developing new technologies to maintain its competitiveness in the market.
In addition to TSMC, Intel is also accelerating its investment in chip testing and packaging factories. Recently, Intel announced plans to invest more than $7 billion in building a new chip packaging and testing factory in Malaysia, which is expected to start production next year. Moreover, Intel is considering significantly increasing its existing $1.5 billion investment in Vietnam to expand its chip testing and packaging factory scale in Southeast Asian countries. Therefore, Samsung will need to accelerate its investment in chip packaging technology to maintain its competitive edge against its rivals and provide more high-quality product choices for electronics component distributors.