US Government to Build Two Large Chip Manufacturing Clusters with CHIPS Act Funds by 2030, Subsidy Applications to Open Next Week.

Electronic component distributors have reason to celebrate as the US government prepares to open up subsidies for domestic chip manufacturing. The Commerce Secretary, Gina Raimondo, announced plans to use funds from the Chips Act to establish two large advanced logic chip manufacturing clusters by 2030, complete with supply chain systems, research and development centers, and infrastructure. Next week, applications for subsidies under the act will open up, with a focus on manufacturing facilities. In the coming months, additional funding opportunities will be provided to supply chain companies and those investing in research and development.

Raimondo emphasized the need for the US to reduce its reliance on foreign supply chains and bring semiconductor manufacturing back to the US. This shift will provide a great opportunity for electronic component distributors as more manufacturing facilities are established in the US. With the establishment of these clusters, the US will be able to design and produce some of the most advanced chips in the world, reducing the need for importation.

The US government's commitment to chip manufacturing will also benefit electronic component distributors by creating more high-paying jobs in the industry. Furthermore, with the government's focus on increasing the number of graduates with semiconductor-related skills, electronic component distributors will have access to a larger pool of skilled workers, including technicians, engineers, and other professionals. As more US-based semiconductor manufacturing facilities open up, electronic component distributors will be well-positioned to benefit from increased demand for their products and services.