Samsung Develops Advanced EUV Film to Boost Wafer Fabrication Competitiveness by 2023

According to a report by Taiwan's Electronic Times, Samsung Electronics is set to introduce its own developed mask coating in extreme ultraviolet (EUV) lithography process by 2023, which is expected to enhance its competitiveness in wafer fabrication and drive demand for mask coating materials and components.

It is reported that Samsung Electronics has begun developing an advanced EUV film to narrow the market share gap with its foundry rival TSMC. A recent recruitment notice from Samsung Semiconductor Research Institute mentioned the development of an EUV film with a transparency of 92%. Previously, reports have shown that Samsung Electronics has already developed an EUV film with a transparency of up to 88% and can produce it on a large scale. This means that the Korean tech giant has achieved its goal and proposed a new development roadmap to increase transparency by 4 percentage points.

TechInsights reported that the real 7LPP process was found in Samsung's Exynos 990, which was included in its flagship product, the Galaxy S20. As expected by the industry, this 7-nanometer EUV process provides the highest density layout observed by Samsung to date.