Canon Launches High-Accuracy Wafer Inspection Machine to Improve Semiconductor Production Efficiency

Canon has recently launched a new wafer inspection system that can improve the efficiency of semiconductor production. This new machine is designed to detect defects and deformations on wafers with high precision before the exposure process for circuit patterns, which can help reduce the time and costs associated with the exposure process and improve the yield rate.

As semiconductor manufacturing processes become increasingly complex, especially for advanced products like logic semiconductors and memory used in computers and smartphones, it is essential to identify and correct any issues that arise during the manufacturing process. This is particularly true for wafers that are subject to deformation due to microfabrication and 3D processing.

Canon has been involved in the production of semiconductor lithography equipment for many years, but this is the first time that the company has offered a standalone measurement machine. The new wafer inspection system has a wavelength range that is 1.5 times wider than its previous models, allowing for more precise detection of deformations.

According to Nikkei News, Canon plans to increase its production of lithography machines and is considering developing the next generation of systems that can produce advanced circuits at a lower cost. In October of last year, Canon announced its plans to construct a new semiconductor equipment factory in Tochigi Prefecture, eastern Japan, with a goal of doubling its current production capacity. The total investment for this project is expected to exceed 50 billion yen (approximately 345 million US dollars), with construction set to begin in 2023 and operations commencing in the spring of 2025.