TSMC Highlights Technological Advancements in Annual Shareholders Meeting

On June 6th, TSMC held its annual shareholders meeting and presented its report highlighting the company's achievements and future plans. TSMC emphasized its commitment to expanding its technological edge and differentiation. In 2022, TSMC invested a staggering $5.47 billion in research and development, focusing on enhancing its competitive advantages.

One of the notable highlights mentioned in the report was the successful production of 5-nanometer technology for the third consecutive year, which contributed to 26% of TSMC's total revenue. Additionally, the N4 process technology entered mass production in 2022 and introduced N4P and N4X variants. The N4P is expected to commence mass production in 2023.

According to the report, TSMC also achieved significant milestones in the development of N3 technology, which commenced mass production in 2022. The N3E technology is projected to enter mass production in the second half of 2023. The N3 family is anticipated to become another large-scale, long-term demand process technology for TSMC. Furthermore, TSMC unveiled N4X as its first technology specifically tailored for high-performance computing (HPC), with customer product design expected to be finalized in 2023.

TSMC emphasized its focus on advancing technology further by transitioning to 2-nanometer technology, adopting nanosheet transistor structures as opposed to the previous FinFET architecture. Compared to N3E, the N2 technology offers a 10%-15% speed improvement at the same power consumption or a 25%-30% power reduction at the same speed, catering to the growing demand for energy-efficient computing solutions.

Expanding upon its commitment to enhancing system-level performance, TSMC continues to expand its 3DFabricTM design solutions. This innovative approach combines wafer-level 3D integration with advanced packaging technologies. Notably, the chip-on-wafer (CoW) technology successfully entered mass production in 2022, demonstrating significant performance optimization by stacking static random-access memory (SRAM) chips on logic wafers.

TSMC remains at the forefront of technological advancements in the electronic components industry, continuously striving to meet the evolving demands of its customers and the market.