SK Hynix Elevates HBM, Korean Innovations
As per a report from BusinessKorea, SK Hynix is presently engaged in an internal recruitment drive for "post-processing" personnel, aimed at scaling up their production capacity. In recent developments within the semiconductor industry on August 24th, SK Hynix's division dedicated to Wafer Level Packaging (WLP) has made a strategic decision to restructure and reinforce its technical workforce as an integral part of their internal Career Growth Program (CGP).
In accordance with a report from "Seoul Economy," insiders have disclosed that SK Hynix's WLP business unit is strategically seeking to augment its backend technical talent pool from within the organization. The company is currently in the process of scrutinizing candidate profiles to determine their suitability for placement within the WLP division. It is anticipated that this departmental restructuring will lead to the addition of several dozen new team members.
The rapid proliferation of Artificial Intelligence (AI) applications is driving a substantial surge in the demand for next-generation High Bandwidth Memory (HBM) chips. This has spurred South Korean semiconductor equipment manufacturers into proactive development of tools and solutions, thereby exploring avenues for revenue growth.
According to a report from ZDNet Korea, South Korean semiconductor equipment manufacturers, including Hanmi, Nextin, and YEST, are actively expanding their capacities while focusing on capitalizing on the burgeoning HBM market demand. They are diligently engaged in the development of relevant backend processes and testing equipment to meet this burgeoning market's needs.
At present, HBM accounts for less than 1% of the overall DRAM market. However, the dynamic expansion of the Artificial Intelligence (AI) and AI semiconductor markets is propelling an escalated demand for HBM. Market analysts are forecasting that global HBM demand is poised to reach 290 million GB by 2023, reflecting a remarkable 60% year-on-year growth, with a potential further 30% uptick in 2024.
During the latter part of 2022, Hanmi Semiconductor introduced a specialized heat compression bonding machine, tailored specifically for HBM3, followed by the launch of a second-generation model in August 2023. This innovative machine utilizes vertical heat and pressure to facilitate the bonding of DRAM chips.
In an endeavor to enhance their production capabilities, Hanmi Semiconductor has also inaugurated a cutting-edge factory, equipped to concurrently assemble and test more than 50 devices within a controlled cleanroom environment.
Leading the way in inspection and testing equipment, Nextin has developed a novel product, purpose-built for HBM applications. They have imminent plans to provide demonstration models to their key clients in the latter half of 2023 to support the production process. This pioneering equipment harnesses optical technology for the detection of foreign substances within HBM and precise measurement of microprotrusions, rendering it a versatile asset for a range of measurement applications.
Recognized for their expertise in thermal processing equipment, YEST is currently spearheading the development of next-generation wafer compression machinery tailored for HBM bottom-fill processes. This intricate process involves the precise filling of inter-chip gaps with insulating resin to safeguard the chips from external contaminants, necessitating the utilization of compression equipment to ensure a seamless and uniform fixation of the insulating resin.
