60% China Sales Dive! Photolithography Giant's Bold Move
Nikon has recently announced the launch of its latest innovation, the NSR-2205iL1, a state-of-the-art i-line stepper photolithography system featuring a 5x reduction ratio. This advanced technology is designed for the production of power, communication, MEMS, and other semiconductor devices while maintaining full compatibility with Nikon's existing i-line exposure systems.
As per official information available on Nikon's website, the NSR-2205iL1 offers exceptional cost-effectiveness compared to its predecessor i-line photolithography machines. This system is capable of optimizing the production of various semiconductor devices across different wafer materials. Anticipated to be available for purchase in the summer of 2024, Nikon highlights that the NSR-2205iL1 represents the company's most significant update to 5x photolithography technology in the past 25 years. This development is a direct response to customer demands, as these lithography systems play a crucial role in chip manufacturing.
Nikon also underscores the soaring demand for semiconductors, particularly those supporting applications like electric vehicles, high-speed communication, and various IT devices. These semiconductors are expected to perform highly complex functions. Consequently, equipment manufacturers require specialized substrates and exposure systems to meet the demands of this burgeoning market.
Traditionally, Nikon met the requirements for lithography systems by refurbishing existing equipment. However, limitations in the supply of refurbished machines often hampered the ability to meet customer demand. To address this challenge and offer versatile exposure equipment solutions, Nikon has introduced a cutting-edge 5x i-line photolithography machine. This innovative machine leverages insights derived from close collaboration with customers, ensuring it meets market demands and mitigates issues related to aging and limited supplies of photolithography machines.
In addition to expanding its range of features to cater to diverse customer needs, this newly developed i-line photolithography machine is engineered to support long-term equipment production.
The NSR-2205iL1, featuring multiple advantages such as multi-point autofocus (AF), advanced wafer stage leveling technology, and an extended depth of focus (DOF), is set to deliver high productivity across various semiconductor manufacturing processes. It promises to optimize yield levels by incorporating high-precision wafer measurements. Furthermore, its compatibility with various wafer thicknesses and sizes, high wafer warp tolerance, and flexible features, including support for SiC and GaN processing, make the NSR-2205iL1 i-line photolithography machine exceptionally well-suited for a wide range of applications. All of this is offered with outstanding cost-effectiveness, ensuring that it meets the diverse requirements of chip manufacturers.
Key specifications of the NSR-2205iL1 include a resolution of ≤ 350 nm, utilization of an i-line (365 nm wavelength) exposure source, a numerical aperture (NA) of 0.45, and a maximum exposure field of 22 mm x 22 mm.
It's noteworthy that Nikon has faced challenges due to restrictions on semiconductor equipment in various international markets this year. In the company's recently published second-quarter performance report, sales of semiconductor photolithography machines saw a decrease from 8 units to 4 units compared to the same period last year. Similarly, sales of photolithography machines for Flat Panel Displays (FPD) dropped from 7 units to 2 units, resulting in a 60% decline in overall photolithography machine sales during the second quarter.
