Global Debut: First Unmanned Semiconductor Packaging Line

In contrast to semiconductor wafer manufacturing, semiconductor packaging demands a substantial human workforce due to the necessity of handling multiple components like substrates and product-laden trays. In the past, packaging processes were predominantly reliant on manual labor. Nevertheless, Samsung Electronics has successfully achieved complete automation through cutting-edge equipment, such as wafer transport systems (OHT), goods-moving elevators, and conveyor systems.

During the "2023 New Generation Semiconductor Packaging Equipment and Material Innovation Strategy Forum," Mr. Kim Hee-yeol, General Manager of Samsung Electronics' Testing and System Packaging (TSP) division, proudly announced the establishment of the world's inaugural unmanned semiconductor packaging facility. This automated production line, situated within Samsung Electronics' packaging facilities in Tianan City and Wenyang City, commenced construction in June 2023. Notably, this pioneering production line reduces its dependence on human labor by an impressive 85%, concurrently achieving a remarkable 90% reduction in equipment failure rates while boosting operational efficiency by over 100%.

Currently, unmanned production lines constitute only about 20% of Samsung's overall packaging manufacturing lines. However, Samsung has articulated an ambitious vision of transforming all its packaging facilities into fully unmanned operations by the year 2030. Mr. Kim Hee-yeol emphasized, "By minimizing the reliance on shift work, engineers can now engage in more value-added tasks." Furthermore, he underscored that this transformative endeavor would significantly contribute to enhancing the well-being and quality of life for the workforce. Mr. Kim Hee-yeol concluded by asserting, "We are on track to realize the concept of a 'smart packaging factory,' underpinned by hardware and software automation, delivering high-quality, cost-effective products to our valued clientele in a timely fashion." This groundbreaking development bears significance for stakeholders seeking cutting-edge semiconductor solutions.