Samsung Cache DRAM: 60% Energy Efficiency Boost

In a recent report from Electronic Times, it has come to light that Samsung Electronics is embarking on the development of a cutting-edge DRAM technology, marking a significant stride beyond its already successful High Bandwidth Memory (HBM) endeavors.

Drawing upon insights from industry insiders, as reported by the Seoul Economic Daily, Samsung's Advanced Packaging (AVP) division is presently engaged in the development of the next-generation "Cache DRAM" technology, with a slated commencement of production in the year 2025. Remarkably, Samsung has unveiled that Cache DRAM promises a substantial enhancement in energy efficiency by an impressive 60%, accompanied by a notable reduction in data transfer latency to the tune of 50%.

An interesting aspect of this development lies in the packaging methodology. In contrast to HBM's horizontal GPU connection, Cache DRAM is engineered to be vertically connected to the GPU. It is noteworthy that this vertical integration allows Cache DRAM to store an equivalent amount of data as the entire HBM with a single chip—a promising revelation.

Samsung's strategic focus on advancing high-speed Cache DRAM and related memory technologies primarily centers on bolstering its competitiveness in the backend processes of semiconductor manufacturing. As we reflect on the year 2022, TSMC achieved revenue of approximately $5.113 billion in the packaging sector, surpassing Samsung's $4 billion.

Of significance, Samsung is proactively investing in the expansion of its advanced packaging technology infrastructure. This commitment encompasses an investment of over 2 trillion Korean won (equivalent to approximately $1.5 billion) in a state-of-the-art packaging production line within a year's span. Furthermore, the establishment of a dedicated AVP business division in 2023 underscores Samsung's determination to catch up with industry rivals such as TSMC.

Industry experts universally concur that, given the mounting complexities in achieving finer circuitry, the ascent of 3D packaging emerges as a pivotal competitive advantage for semiconductor companies. It stands to reason that, if Samsung is to realize its ambition of becoming a leading force in system semiconductors by 2030, strategic investments in cutting-edge packaging technologies are non-negotiable.