Samsung's Game-Changing HBM4 Tech in 2026

As reported by South Korean media sources, Samsung is embarking on a substantial transformation of its next-generation product manufacturing technology to capitalize on the rapidly expanding High Bandwidth Memory (HBM) market. The company is anticipated to commence mass production of its forthcoming HBM4 product in 2026.

Starting from the initial HBM generation in 2013 to the imminent HBM3E, which marks the fifth generation, each chip boasts an impressive 1024 Input/Output (I/O) interfaces. Notably, HBM with over 2000 I/O interfaces has yet to be introduced.

In the context of shifting demand among various HBM generations, TrendForce, a reputable consulting firm, forecasts a transition in mainstream demand during 2023. This transition involves a shift from HBM2e to HBM3, with estimated proportions of approximately 50% and 39%, respectively. As the utilization of HBM3-equipped acceleration chips gains momentum in 2024, market demand is expected to significantly pivot towards HBM3, surpassing HBM2e directly, with an estimated proportion of 60%. This transition, coupled with the prospect of higher average selling prices (ASPs), is poised to drive substantial revenue growth in the HBM sector the following year.

Analyzing the dynamics of HBM supply and demand, TrendForce points out that while 2022 witnessed a stable supply, the explosive surge in AI demand during 2023 led to pre-orders from customers. Despite original manufacturers expanding their production capacities, they still struggled to fully meet customer demands.

Looking forward to 2024, TrendForce holds the belief that, owing to the proactive expansion of production capacities by various original manufacturers, the HBM supply-demand ratio, also known as the Sufficiency Ratio, is expected to improve. Projections indicate that it will shift from a deficit of -2.4% in 2023 to a surplus of 0.6%. These developments suggest a more balanced market environment in the realm of HBM technology.