In this comprehensive guide, we delve into the workings of a high-frequency soldering iron, employing the eddy current heating principle, akin to household induction cooktops. This technology is remarkably efficient and cost-effective. We explore its core components, circuitry, and practical aspects, aiming to provide valuable insights for both enthusiasts and professionals in the field.
Section One: Main Circuitry Diagram
1. Transformer T1: Utilizing the ATX power supply's core (optional air gap) - EI33.
· Primary Winding: A direct winding of 34 turns using φ0.7 single-strand wire.
· Secondary Winding: φ0.7 wire wound with 12+7 turns. For 90W, use 12 turns; for 150W, use 19 turns.
· Primary Inductance (L_primary): 0.718mH (100KHz/1.0V).
2. Transformer T2: The core for driving from the ATX power supply (no air gap required).
· Inductance (Ln): 0.516mH (100KHz/1.0V).
· Primary with 30 turns and secondary with 36 turns. Wound with φ0.25 enameled wire meters.
· Note: Ensure same terminals are connected.
3. L1 Inductance: Employing a T106-2 magnetic ring (black and red), wound with 24 turns of φ1.0 wire. Using other colored rings may result in significant heating. This ring serves as a load in case of accidental short circuits in the handle heating coil and can be omitted under normal conditions.
4. Auxiliary Power Supply: An independent switching power supply provides a 12V DC power source for SG3525 and the temperature control board, with a low output current requirement of 12V 1A.
5. PCB Size: Designed for compatibility with a 10555150 aluminum alloy housing. For different housing sizes, custom layout adjustments are necessary.
Section Two: Temperature Control
The temperature control system simplifies the soldering iron's main functions to temperature adjustment, sleep mode, and automatic shutdown. It does not function as a thermometer but rather serves to maintain and indicate the soldering iron's approximate temperature.
Section Three: Physical Construction
1. Housing: An aluminum alloy case measuring 10555150 is recommended. Users may create custom openings in the front and back panels as needed.
2. Mainboard: The circuit boasts a substantial power margin, supporting the use of 203H and 205H handles. Remarkably, the circuit generates no heat, and the two push-pull MOSFETs remain cool throughout operation.
3. Temperature Control: Implemented via PID control, the temperature control system maintains a temperature accuracy within ±3 degrees. It's important to note that the high-frequency soldering iron requires approximately 20 seconds to reach solder-melting temperature, surpassing the capabilities of traditional T12 soldering irons in terms of power margin and reheat capability.
4. Handle: The handle features a pure silver heating core with a measured resistance of 0.7 ohms.
Section Four: Troubleshooting and Optimization
Before connecting the handle, it's advisable to observe the circuit's waveform for initial troubleshooting.
In Conclusion:
This high-frequency soldering iron project incorporates a professionally designed handle and casing, while other components are repurposed from an old ATX power supply and existing inventory. The temperature control section adopts T12 source code, resulting in a cost-effective solution with a highly satisfactory performance profile.