STMicro Unveils New Automotive Module - ACEPACK DMT-32

STMicroelectronics has unveiled an innovative 32-pin, dual-row molded through-hole power module from its ACEPACK DMT-32 series, leveraging Silicon Carbide (SiC) technology. Specifically designed for automotive applications, this module features a compelling combination of high power density, a compact design, and a simplified assembly process. Its versatile applications span across onboard chargers (OBC), DC/DC converters, fluid pumps, air conditioning systems, and more.

This product line provides system designers with a range of configurations, including four-pack, six-pack, and totem pole options, enhancing flexibility in design. Encapsulating 1,200V Silicon Carbide (SiC) power switches, these modules harness STMicroelectronics' advanced second and third-generation SiC MOSFET technology, renowned for its exceptional electrical characteristics and thermal performance. This technology ensures low RDS (on) values and efficient switching performance.

The implementation of Direct Bonded Copper (DBC) packaging technology, based on aluminum nitride (AlN), guarantees exceptional thermal conductivity while simultaneously minimizing thermal resistance and maintaining high electrical insulation. STMicroelectronics' ACEPACK technology integration not only streamlines system and design development but also guarantees product reliability. High-performance aluminum nitride (AlN) insulation substrates further enhance thermal performance, with an integrated NTC sensor for real-time temperature monitoring and thermal protection.

This cutting-edge Silicon Carbide (SiC) power module promises to elevate efficiency and reliability within automotive electronic systems while also reducing overall design and manufacturing costs. It is poised to become an indispensable component of future automotive electronic systems, solidifying STMicroelectronics' position as a leader in the automotive semiconductor market.