World's First 100mm Monocrystalline Diamond Wafer Revealed

Diamond Foundry Inc., headquartered in San Francisco, has recently achieved a groundbreaking milestone by successfully manufacturing monocrystalline diamond wafers with a remarkable diameter of up to 100 millimeters. This significant advancement positions Diamond Foundry as a pioneer in the global electronic components landscape.

The company strategically plans to deploy these diamond substrates to optimize thermal performance, consequently enhancing the capabilities of artificial intelligence computing, wireless communication, and the downsizing of power electronic devices.

Implementing state-of-the-art heterogeneous epitaxial processes, Diamond Foundry has developed these monocrystalline diamonds on a scalable substrate. Distinguished from previous diamond chips created from compressed diamond powder, this innovative wafer embodies the unique characteristics of monocrystalline diamond.

With a commitment to continuous improvement, Diamond Foundry aims to reduce the defect density of its diamond wafers, aiming for quality factors that surpass silicon (Si) by 17,200 times and silicon carbide (SiC) by 60 times.

Established in 2012 and currently operating a production facility in Washington state, Diamond Foundry spans across the jewelry, luxury goods, and semiconductor sectors. Bolstered by $5.15 billion in funding, the company is in the midst of a substantial expansion plan, utilizing zero-emission energy to convert greenhouse gases into diamond silicon wafers.

By employing a groundbreaking process that involves atomic-level bonding of diamonds to integrated circuit (IC) wafers, Diamond Foundry has achieved a cutting-edge method of thermal chip packaging. The superior thermal conductivity of monocrystalline diamond translates into faster chip operation, extended lifespan, and optimal heat dissipation, resulting in a threefold increase in computational speed.

Simultaneously, these diamond materials showcase exceptional electrical insulation properties. Even the thinnest diamond slices can effectively isolate high voltages, pushing the boundaries of miniaturization in power electronic devices.

These remarkable attributes position Diamond Foundry's solutions as ideal for high-power chips, seamlessly integrating silicon chips with diamond semiconductor substrates to significantly accelerate cloud computing and artificial intelligence calculations. This innovative approach also streamlines inverter design, fostering advancements in miniaturization, efficiency, and overall robustness.

Beyond its applications in high-tech computing, diamond wafers also hold promise for the wireless communication sector. They address and surpass challenges related to overheating and voltage in Gallium Nitride (GaN), outperforming Silicon Carbide (SiC) across various performance metrics. Diamond Foundry's cutting-edge developments are poised to make a lasting impact on the ever-evolving landscape of electronic components and semiconductor technology.