Next-Gen AMD Chip: Utilizing TSMC 3nm and Samsung 4nm Processes

In recent media reports, it has been revealed that AMD's forthcoming chip core architecture, codenamed Zen 5C, is likely to be designated as "Prometheus." This highly anticipated chip is slated to incorporate cutting-edge technology, utilizing both the 4nm process from Samsung and the 3nm process from TSMC. These advancements hold significant implications for the electronic components industry.

Analyzing profiles and project responsibilities on LinkedIn has uncovered that AMD's upcoming processor IP will leverage the advanced process technologies of TSMC's N3 process and Samsung's 4nm process. Historically, AMD has exclusively relied on TSMC for its manufacturing needs.

Previous speculations hinted at a potential shift in production to Samsung, specifically leveraging its 4nm process technology. However, the exact scale of this potential collaboration remains uncertain. Current information suggests that AMD may utilize Samsung's foundries for testing or specific I/O chips, though major IP production on Samsung's 4nm process seems less likely.

Noteworthy in leaked information is a new codename—Prometheus. Past revelations indicated Zen 4's codename as Persephone, Zen 5 as Nirvana, and Zen 6 as Morpheus. Considering the Zen 4C core's codename as Dionysus, it is highly probable that Zen 5C's core will be designated as Prometheus.

AMD's Zen 5 and Zen 5C core architectures are anticipated as significant products in 2024-2025, providing crucial support for various devices, including Strix Point (Ryzen laptops), Granite Ridge (Ryzen desktops), and Turin (EPYC servers). This development carries substantial implications for the technology landscape, attracting attention from stakeholders preparing for advancements in the coming years.