Micron's Roadmap: GDDR7 by Year-End, 256GB DDR5-12800 in 2025

Micron has recently unveiled an updated product roadmap, showcasing innovations tailored for servers, desktops, and mobile chips. Noteworthy additions include DDR5-12800 memory modules with an impressive 256GB capacity per unit and the highly anticipated launch of GDDR7, specifically designed for NVIDIA's upcoming GPU, slated for the end of 2024.

This revised Micron roadmap extends its vision until 2028, encompassing two additional years beyond the previous iteration from July of the preceding year. The realignment of content and the introduction of novel products are notable aspects of this update. Of particular interest is the inclusion of HBM4, formerly known as "HBM Next." Micron's existing HBM3 Gen 2, boasting a speed of 1.2TB/s with 8 stacks, will be surpassed by HBM4's anticipated 2026 release, offering over 1.5TB/s bandwidth with 12 to 16 stacks, setting the standard before 2027. The second generation HBM4e, expected by 2027, promises even higher capacity and exceeding 2TB/s in bandwidth.

For gaming enthusiasts, the rollout of GDDR7 has been rescheduled to the conclusion of 2024, deviating from Micron's initial projection of a first-half 2024 release. GDDR7, compared to the fastest GDDR6X modules with a maximum 16Gb capacity and 24Gb/s bandwidth, boasts increased capacity and bandwidth. The inaugural batch of GDDR7 will feature a 24Gb capacity, operating at 32Gb/s. Subsequent increases in bandwidth and capacity are anticipated in the latter half of 2026, reaching 36Gb/s. NVIDIA has signaled that Blackwell is expected to launch in 2025, with the next-generation GeForce RTX 50 series likely incorporating Micron's GDDR7.

Addressing DDR5 memory, Micron has outlined distinct plans for consumer and data center DIMMs, driven by the recently announced 32Gb single-die design. This high-capacity module, set to be incorporated into 128GB DDR5-8000 memory sticks, is poised to support desktop users by 2026. Concurrently, Micron is actively developing Multi-Chip Registered DIMM (MCRDIMM) products for servers, operating at an impressive 8000MT/s. The pinnacle of this design will be a 256GB memory stick running at 12800Mb/s, scheduled for release by the close of 2025.

In the mobile sector, Micron is aligning with the CAMM standard introduced by Dell at the close of 2024. Micron's strategic focus appears to prioritize capacity over bandwidth, with plans to utilize 8533Mb/s memory sticks until 2026. The first-generation design will offer memory capacities ranging from 16GB to 128GB, with the expectation of further increases to 192GB or beyond by the second half of 2026.