Gelsinger: Intel's German Plant to Produce 1.5nm Chips

Intel's state-of-the-art semiconductor manufacturing facility, located near Magdeburg, Germany, is poised to become the forefront of global technological innovation. As affirmed by Intel's CEO, Pat Gelsinger, upon commencement of operations, the Magdeburg plant will stand as the world's most advanced wafer fabrication facility, leveraging cutting-edge process technologies beyond Intel 18A (1.8nm level).

The facility, strategically positioned in Europe, will utilize Intel's advanced process technologies, extending beyond Intel 18A, to process wafers for both Intel's internal production requirements and its Intel Foundry Services (IFS) clientele.

Although specific details about the Intel 18A and subsequent process technologies adopted at the Magdeburg facility are not disclosed, the company has alluded to the implementation of the 1.5nm process technology.

Gelsinger emphasized, "The Magdeburg facility, upon operationalization, will represent a pinnacle of technological advancement. Our most sophisticated process technology, denoted as Intel 18A, 2nm and below, is on the verge of production, and Magdeburg will surpass these milestones, manufacturing devices at the 1.5nm scale."

Intel is set to reveal the comprehensive manufacturing process roadmap for Intel 18A and beyond in late February. This announcement may shed light on the wafer fabrication plants that will be early adopters of this next-generation node technology, potentially including Intel 16A and Intel 14A.

Noteworthy is Intel's commitment to bringing cutting-edge manufacturing technology to Europe, marking a rare initiative in the semiconductor industry. Presently, Intel's Fab 34 facility near Leixlip, Ireland, is utilizing Intel 4 (7nm level) process technology, with Intel 3 (5nm level) chip production anticipated in the coming quarters. While Intel 4 and Intel 3 represent the company's current advanced nodes, Intel foresees that Intel 18A and subsequent products will lead the industry in power efficiency, performance, and overall area characteristics.