Rapidus: 2nm Trial Production Starts April 2025
On January 22nd, Rapidus announced the forthcoming operationalization of its state-of-the-art logic chip manufacturing facility, "IIM-1," located in Chitose City, Hokkaido. This cutting-edge facility, designed for logic chip production below the 2nm threshold, is scheduled to commence operations in April 2025, following its construction initiation in September 2023.
Rapidus has already established its "Chitose Office" in the same city, serving as the central point for the company's engagements in Hokkaido. This office facilitates discussions with local businesses and oversees administrative functions, including general affairs and recruitment.
In its commitment to advancing 2nm logic chip production technologies, Rapidus has engaged in collaborations with global semiconductor research centers. Researchers from Rapidus are actively involved in one of the world's foremost semiconductor research hubs, the IBM "Albany NanoTech Complex" in New York, USA, focusing on the research and development of technologies associated with 2nm logic chip production. Additionally, Rapidus is planning to explore essential EUV lithography technology at the imec semiconductor research institute in Belgium.
The trial production line for "IIM-1" is slated for operationalization in April 2025, with mass production anticipated to commence in 2027, adhering to the outlined plan.
During a press conference in Chitose City, Rapidus President Junichi Koike communicated that the construction of the 2nm factory proceeded smoothly, with the trial production line set to start as scheduled in April 2025. Koike emphasized that the construction project adhered to the original timeline without any delays. Furthermore, he hinted at future plans, stating, "We are considering the construction of a second and third factory."
Established in August 2022, Rapidus is a collaborative venture involving eight prominent Japanese companies, including Toyota, Sony, NTT, NEC, Softbank, Denso, Kioxia, and Mitsubishi UFJ. Each company contributed 7.3 billion yen, and the Japanese government is providing a subsidy of 70 billion yen as part of its research and development budget. The overarching goal is to commence mass production of advanced 2nm process chips in 2027. Rapidus aims to domestically produce advanced logic chips for applications such as autonomous driving and artificial intelligence.
In late February 2023, Rapidus announced the construction of a 2nm semiconductor foundry in Chitose City, Hokkaido. Leveraging IBM's 2nm process technology, Rapidus plans to develop its "Rapidus version" manufacturing technology, targeting mass production in 2027. The "Rapidus version" will focus on "High-Performance Computing (HPC)" and "Ultra-Low Power" directions. Market sources indicate that the Rapidus Hokkaido 2nm production line will go through three or four phases, known as Innovative Integration Manufacturing (IIM). The IIM-1 phase will manufacture 2nm chips, while IIM-2 will handle even more advanced processes than 2nm.
In early September 2023, construction officially commenced for Rapidus's 2nm wafer fab, with foundational work largely completed by December 2023. Construction of the above-ground facility commenced in January 2024, with the structural framework expected to be completed between April and May of the same year. The factory is estimated to be completed by December, with Rapidus aiming to establish the first prototype production line by 2025 and commence mass production of 2nm chips in 2027.
Rapidus has engaged in deep collaborations with IBM, ASML, and has sent 100 engineers to IBM for learning 2nm chip manufacturing and GAA transistor technology.
