TSMC to Expand CoWoS Packaging in Japan

TSMC has recently completed its inaugural wafer fab in Japan. Reports from industry insiders suggest that TSMC is contemplating the establishment of advanced packaging capabilities in Japan, potentially contributing to the resurgence of the semiconductor industry in the country. While plans are still in their early stages, sources prefer to remain anonymous due to the sensitive nature of the information.

Insiders reveal that TSMC is exploring the introduction of CoWoS advanced packaging technology in Japan. Presently, similar capacities of TSMC are located in Taiwan, China. However, specifics regarding investment amounts and timelines remain undetermined.

In response to these rumors, TSMC has chosen not to comment on the matter.

The escalating demand for advanced semiconductor packaging, driven by advancements in artificial intelligence (AI), has prompted leading chip manufacturers such as TSMC, Samsung, and Intel to intensify their capacity expansions. TSMC previously announced plans to double CoWoS capacity this year and continue expanding through 2025.

In addition to TSMC's initiatives, Outsourced Semiconductor Assembly and Test (OSAT) companies like ASE, Amkor, and JCET are also actively increasing capital expenditures to bolster their advanced packaging capabilities.

It's worth noting that in 2021, TSMC established an advanced packaging research center in Ibaraki Prefecture, north of Tokyo, Japan. With Japan's wealth of advanced semiconductor materials and equipment manufacturers, the region offers promising conditions for the development of advanced packaging technologies.