Apple Trials SoIC at TSMC, 2025 Mass Production

According to reports from reputable sources like Naver, Apple is currently in the preliminary stages of testing its latest 3D chip stacking technology, SoIC (System Integration Chip), at Taiwan Semiconductor Manufacturing Company (TSMC). The timeline suggests that consumers may see products featuring this technology as early as 2025 to 2026.

Insider information indicates that TSMC is actively working to enhance its CoWoS (Chip on Wafer on Substrate) advanced packaging capacity while simultaneously advancing its next-generation 3D stacking solution, SoIC. Apple is particularly intrigued by the potential of SoIC packaging for mass-producing its next-generation AP (Application Processor) chips. Rumors suggest that Apple may opt for a SoIC with Hybrid Molding (utilizing Thermoplastic Carbon Fiber Board Composite Molding Technology).

It's rumored that TSMC will commence small-scale trials of SoIC, with mass production anticipated between 2025 and 2026, aligning with previous market speculations. Last year's reports hinted at Apple's experimentation with SoIC technology, potentially integrated with the InFO (Integrated Fan-Out) packaging scheme, based on comprehensive considerations such as product design, positioning, and cost, with a projected launch window around 2025 to 2026.

TSMC's SoIC represents a significant leap in high-density 3D chip stacking technology. Leveraging Chip on Wafer (CoW) packaging technology, it enables the integration of heterogeneous chips of varying sizes, functionalities, and nodes, with mass production slated at TSMC's Nanjing Plant (AP6). Compared to existing 2.5D solutions, SoIC offers a higher bump density, thereby reducing overall power consumption while simultaneously enhancing density and transmission rates, resulting in heightened memory bandwidth.

Moreover, SoIC packaging presents the added benefit of reducing footprint, affording Apple the flexibility to mass-produce smaller chips and optimize space efficiency. According to industry insights from WCCFtech, this technology also promises to lower the cost of integrated circuit boards, potentially yielding substantial cost savings for Apple. Although the specific product lineup for this chip remains undisclosed, reports suggest that it may find its debut within the MacBook series.