Intel Completes First High-NA EUV Assembly

On April 18, Intel, a leading semiconductor manufacturer, announced the successful assembly of the industry's first commercial High-NA EUV lithography machine at its research center in Oregon.

Intel is currently calibrating the ASML TWINSCAN EXE:5000 High-NA EUV lithography machine to prepare for its future production roadmap. This state-of-the-art equipment significantly enhances the resolution and functionality of next-generation processors by modifying the optical design for projecting printed images onto silicon wafers.

As part of its strategic plan to advance through five process nodes over the next four years, culminating in the advanced Intel 18A process, Intel plans to integrate High-NA EUV technology in its Intel 14A process. Analyst estimates place the cost of the High-NA EUV equipment at approximately 250 million euros.

Intel recently disclosed plans to develop the Intel 14A and Intel 14A-E processes by 2027.

Intel emphasized that the High-NA EUV machine, TWINSCAN EXE:5000, is currently undergoing calibration. In conjunction with other cutting-edge technologies in the company's fabrication facilities, it is expected to produce features up to 1.7 times smaller than existing EUV technology.

Furthermore, Intel announced its intent to be one of the first adopters of ASML's next-generation High-NA EUV system, the TWINSCAN EXE:5200B, which offers enhanced performance.