MediaTek Unveils Dimensity 6300: TSMC 6nm Process

MediaTek has launched the Dimensity 6300, a mobile 5G chipset designed to deliver exceptional gaming and imaging experiences to mainstream 5G smartphones. This chip supports 108-megapixel cameras and advanced noise reduction technology, and it incorporates MediaTek's HyperEngine gaming technology for superior gaming performance.

Manufactured using TSMC's 6nm process, the Dimensity 6300 provides low power consumption and extended battery life for smartphone users. Its CPU consists of two 2.4GHz Cortex-A76 cores and six 2.0GHz Cortex-A55 cores, while the GPU integrates the Arm Mali-G57 MC2 GPU. The chip supports LPDDR4x memory and UFS 2.2 flash storage standards. It includes a 5G modem compliant with the 3GPP R16 standard, delivering up to 3.3 Gbps downlink speeds through 140MHz cellular bands and 2CC carrier aggregation technology.

The Dimensity 6300 supports display resolutions up to 2520 x 1080, a 120Hz refresh rate, and 10-bit color depth for vivid and realistic images and videos on AMOLED screens, enhancing the overall user experience.

For gaming, the 2.4GHz CPU offers a 10% increase in game fluidity compared to the previous generation, while the GPU performance is over 50% better than similar products. MediaTek's HyperEngine gaming technology offers comprehensive gaming enhancements, including an 11% improvement in gaming efficiency and a 13% boost in high-quality game frame rates. Additionally, the chipset supports smart 5G and Wi-Fi connectivity prediction, 5G call and data concurrency, and a more reliable connection experience to ensure continuous online gaming.