TSMC US Wafer Fab Explosion: Worker Severely Injured!

On May 15th, an incident transpired at TSMC's semiconductor wafer fab in Phoenix, prompting a swift response from firefighting teams. According to local authorities, firefighters from Phoenix, Glendale, and Daisy Mountain departments were dispatched around 2:30 PM to address the situation.

Reports indicate that a worker sustained severe injuries and was promptly transported to the hospital. TSMC has stated that the explosion resulted from an anomaly with an outsourced sulfuric acid transport tanker, leading to the injury. The company assured that the incident, under investigation by firefighting units, will not hinder its operations or projects.

The explosion did not cause any damage to TSMC's semiconductor wafer foundry facilities.

TSMC's ongoing projects in Phoenix face delays due to various challenges, including a shortage of skilled workers. The production timeline for Fab21, utilizing the 4nm process, has been postponed from 2024 to 2025. Similarly, Fab2's production, initially set for 2026 with the 3nm process, is now anticipated for 2028. Upon completion, the combined annual capacity of these facilities is projected to exceed 600,000 wafers, with an estimated market value exceeding $40 billion.

In April, the U.S. Department of Commerce announced substantial support for TSMC's endeavors in Arizona, allocating up to $6.6 billion in subsidy funds and $5 billion in low-interest loans under the CHIPS Act. Concurrently, TSMC revealed a $25 billion increase in investment to construct a third wafer fab in Arizona, aiming to commence chip production using 2nm or more advanced process technology by the late 2020s (2029-2030).