Samsung Unveils 3nm Exynos W1000 with FOPLP

On July 3rd, Samsung announced the Exynos W1000, its first wearable device SoC utilizing the cutting-edge 3nm GAA process. This advanced manufacturing and packaging technology enhances performance while reducing size, providing more space for batteries and increasing design flexibility for smartwatches.

The Exynos W1000 boasts a new CPU architecture with one high-performance Cortex-A78 core clocked at 1.6GHz and four energy-efficient Cortex-A55 cores at 1.5GHz. Paired with LPDDR5 memory, it ensures smooth performance. Compared to its predecessor, the Exynos W930, the Exynos W1000 delivers a 3.7x improvement in multi-core performance. For everyday tasks, its acceleration feature enables apps to launch 2.7x faster and allows seamless switching between multiple applications. Additionally, the chip includes a Mali-G68 MP2 GPU, supporting display resolutions of 960x540 and 640x640, and integrates 32GB of eMMC storage.

Samsung highlights that the Exynos W1000 employs Fan-Out Panel Level Packaging (FOPLP) for a reduced size and improved thermal performance. It also utilizes System-in-Package (SiP) technology, integrating the power management chip (PMIC) and combining DRAM and NAND memory using ePoP packaging. These innovations enable the Exynos W1000 to achieve a more compact and thinner package.

The Exynos W1000 supports 2.5D Always-on Display (AoD) functionality, enhancing the display with detailed watch faces.

The Exynos W1000 is expected to debut in the upcoming Galaxy Watch 7 smartwatch. Samsung Electronics will hold its second Galaxy Unpacked event of the year on July 10 at 10 PM (local time 3 PM) in Paris, where it will unveil new foldable phones and wearable devices.

Samsung also announced plans to accelerate the mass production of the Exynos 2500 chip, based on the 3nm process, which is expected to feature in the Galaxy S25 series smartphones, slated for release in early 2025.