Intel Selects TSMC: Next-Gen AI Chip at 3nm with CoWoS

Intel is set to advance its artificial intelligence (AI) capabilities with Falcon Shores, the next-generation AI chip leveraging TSMC's cutting-edge 3nm process and CoWoS packaging technology. The chip has successfully completed tape out and is slated for mass production by late next year.

Following Intel's acquisition of Habana, the company is integrating Habana's advanced AI technology with its own GPU expertise to bolster computational performance. Falcon Shores will introduce a new AI chip platform, promising compatibility with Gaudi3 and plans to launch at least three distinct tiers catering to various market segments, from high-end to mainstream, capitalizing on the burgeoning AI computing opportunities.

Industry analysts highlight that Intel's previous AI server solution, MAX GPU, utilized advanced 7nm processes and Intel's proprietary EMIB and Foveros 3D technologies to enhance performance, albeit with higher energy consumption. By adopting TSMC's solution, Intel aims to address energy efficiency concerns while enhancing computational capabilities.

Both TSMC and Intel have refrained from commenting on these developments.

Earlier reports from June revealed that TSMC has commenced wafer production for Intel's upcoming 3nm chips for laptop processors. Intel plans to transition to its new laptop processor platform in the latter half of this year, with the Lunar Lake and Arrow Lake series scheduled for release by the end of the third and fourth quarters, respectively.