On July 30, South Korea's leading memory chip manufacturer, SK Hynix, officially announced the launch of its next-generation GDDR7 memory, the highest-performance graphics memory globally.
In a statement, SK Hynix highlighted the advanced capabilities of GDDR7: "Engineered for high-speed graphic processing, GDDR7 is drawing significant attention from AI applications globally. Developed with the latest specifications in March, this groundbreaking product will enter mass production in the third quarter of this year."
The GDDR7 memory achieves an astounding operational speed of up to 32Gbps (32 gigabits per second), marking a more than 60% improvement over its predecessor. Depending on the usage environment, speeds can soar to 40Gbps. This new memory can process over 1.5TB of data per second, equivalent to handling 300 Full-HD movies (5GB each) in just one second.
In addition to its superior speed, the GDDR7 offers more than a 50% boost in energy efficiency compared to the previous generation. To manage the heat generated from ultra-fast data processing, SK Hynix has incorporated innovative packaging technology in its development.
The SK Hynix technical team has retained the product’s compact size while enhancing the heat-dissipating substrate from four to six layers and utilizing high-thermal-conductivity epoxy molding compound (EMC) in the packaging materials. This advancement has successfully reduced the product's thermal resistance by 74% compared to its predecessor.
Lee Sang-kwon, Vice President of DRAM PP&E at SK Hynix, stated, "SK Hynix's GDDR7 sets a new standard in graphics memory with its exceptional speed and energy efficiency. Its applications will extend from high-performance 3D graphics to AI, high-performance computing (HPC), and autonomous driving. This product will not only bolster our high-end memory product line but also solidify our position as the most trusted AI memory solutions provider."