NVIDIA to Cancel B100, Shift Focus to B200A

NVIDIA is reportedly adjusting its product strategy due to insufficient CoWoS-L production capacity. The company plans to focus on producing the GB200 while using CoWoS-S packaging for the B200A, and introducing the entry-level GB210A. Although NVIDIA and wafer foundries have not confirmed these reports, sources within the supply chain indicate that the B100 will be discontinued, and the main product, B200, will be delayed. TSMC is actively expanding its CoWoS production capacity to balance supply and demand.

CoWoS-L packaging requires the complex integration of top-tier chips, interposers, and HBM, currently yielding lower-than-targeted rates. To address this, TSMC is increasing CoWoS-L production capacity, with Taiwanese CoWoS equipment manufacturers fully booked with orders.

NVIDIA's reported adjustments include canceling the low-demand B100. Future B200 shipments will be paired with the GB200 Ariel/Bianca. Additionally, a downgraded B200A will use the more mature CoWoS-S packaging, alongside the new entry-level GB210A.

The key difference between CoWoS-L and CoWoS-S advanced packaging lies in the former's need for extensive pick-and-place equipment, embedding partial silicon interposers and other components in the RDL. This makes the yield rate and capacity expansion of CoWoS-L a focal point.

Regarding the B200A's performance, the CoWoS-L advanced packaging, with its larger silicon interposer, initially supported two B-series GPU dies and eight HBM3e stacks. The B200A, however, will house only one B-series GPU and four HBM3e stacks, leading to a lower product price to avoid impacting the B200 market. Rumors suggest that NVIDIA may limit the GB210A to inference tasks through CUDA and software constraints.

The B200A's performance is comparable to the H200, making the B200 still the top choice for high performance. Orders for the now-discontinued B100 may shift to the B200 or B200A. Additionally, the B200A's air-cooled solution could appeal to data centers that do not require extensive modifications, opening new market opportunities.

Despite these adjustments, delays in shipment schedules could drive customers towards AMD's MI300/325 or Intel's Gaudi3. NVIDIA's strategic shifts are causing significant changes within the supply chain, warranting close monitoring. Industry insiders predict that TSMC's CoWoS capacity will increase to 65,000 units by the end of next year, driven by strong AI demand.