Samsung Unveils World's Thinnest LPDDR5X DRAM

Samsung Electronics announced the launch of the world's thinnest 12nm Low Power Double Data Rate 5X DRAM (LPDDR5X) on the 6th. This advanced memory module, with a packaging thickness of just 0.65mm, is available in 12GB and 16GB capacities.

The LPDDR5X employs cutting-edge 12nm technology and a four-layer stacking structure, featuring optimized processes for printed circuit boards (PCB) and epoxy molding compounds (EMC). This innovative design achieves a 9% reduction in thickness and a 21.2% improvement in heat resistance compared to previous generations. Samsung's refined back-lap process has also contributed to achieving the industry's thinnest packaging.

The ultra-thin LPDDR5X packaging facilitates the design of slimmer devices and ensures stable thermal management, minimizing performance issues related to heat, such as speed and screen brightness. Beyond mobile devices, LPDDR memory is now used in AI accelerators, computers, and various data-generating devices, making it an indispensable component of core memory systems.

Samsung is set to supply the 0.65mm LPDDR5X DRAM chips to mobile processor manufacturers and device makers, further expanding the low-power DRAM market. The company is also committed to enhancing its LPDDR5X product lineup, including the development of more compact packages such as 24GB six-layer and 32GB eight-layer modules.