TSMC to Launch 2nm CyberShuttle Service in September

TSMC is set to launch its CyberShuttle service in September, allowing multiple customers to share a single wafer. This service, offered twice a year in March and September, provides companies a strategic opportunity to advance their semiconductor process plans for the second half of this year and the first half of the next. Notably, this upcoming round will feature a new 2nm option, expected to attract semiconductor design companies looking to secure a competitive edge in the market.

TSMC reports steady progress on its 2nm technology, with mass production at the new Baoshan facility in Hsinchu scheduled for 2025. Furthermore, the company plans to bring its N2P and A16 technologies into mass production in the second half of 2026, promising significant improvements in power efficiency and chip density.

Industry experts from the ASIC (Application-Specific Integrated Circuit) sector have observed that while there are currently limited projects utilizing advanced nodes below 7nm through the CyberShuttle program, most activity focuses on mature process technologies. This trend indicates that future competition will likely be centered among a few leading-edge manufacturers. Companies that miss the first opportunity to adopt 2nm technology may find themselves trailing competitors by up to six months, highlighting the importance of securing a spot in the CyberShuttle program.

CyberShuttle, also known as MPW (Multi-Project Wafer), allows multiple chip designs with similar process requirements to be placed on the same test wafer. This enables each design to produce dozens of chip samples post-fabrication. The shared approach reduces photomask costs and accelerates chip prototyping and validation, thereby enhancing cost efficiency and operational effectiveness for companies.

TSMC's CyberShuttle service also facilitates the validation of IP, standard cell, and I/O sub-circuit functionalities for process compatibility. It is reported that the CyberShuttle program can reduce costs by up to 90% compared to traditional prototyping methods. Currently, TSMC's CyberShuttle service encompasses the broadest range of technologies available and can provide up to 10 shuttle opportunities each month.