VIS Singapore 12-Inch Fab Approved, Construction Starts H2

On September 4, Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors announced the official establishment of their joint venture, VisionPower Semiconductor Manufacturing Company (VSMC), in Singapore. The new 12-inch (300mm) wafer fab project has received approval from regulatory authorities in Taiwan and Singapore. Construction of the VSMC fab is set to begin in the second half of this year.

Leuh Fang, Chairman of VIS, expressed gratitude for the support from regulatory bodies, stating that the approval enables the project to move forward as planned. Fang emphasized that the new fab reflects VIS's commitment to meeting growing demand, expanding production capabilities, and diversifying its global manufacturing footprint.

The joint venture between VIS and NXP was initially announced on June 5, with a total investment of approximately $7.8 billion to build the 12-inch wafer facility in Singapore. The fab's process nodes will range from 0.13µm to 40nm, focusing on power management, analog, and mixed-signal products, with primary applications in industrial and automotive sectors, along with some consumer products.

Industry experts predict that the fab will begin trial production by 2027, with full-scale operations expected in 2029. Supported by technology from TSMC, the new fab is anticipated to contribute significantly to long-term growth and profitability.