ASML High-NA EUV Priced Over €400M; R&D Orders In

ASML has announced the launch of its new High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) lithography equipment, with plans to commence mass production by 2026. The company revealed that all EUV clients have placed orders at the research and development stage. Industry analysts anticipate that the new equipment will benefit key players such as ADAC, Chroma, Huali, and Hon Hai as advanced process technologies continue to evolve.

TSMC, one of ASML's major clients, is the first to incorporate EUV lithography equipment into its 7nm production line. While TSMC plans to acquire High-NA EUV equipment this year primarily for research purposes, it has not yet begun to use it in production. The industry estimates that the High-NA EUV machines are priced above €400 million (approximately NT$14.1 billion), reflecting their advanced capabilities.

ASML aims to deliver at least 5 to 6 units of the High-NA EUV machines this year. Intel has already ordered its first unit, which is expected to be assembled by April and used for 14A process technology starting in 2027. TSMC is confirmed to purchase at least one unit this year, while SK Hynix plans to integrate the equipment next year. Samsung, originally planning to acquire a unit next year, hopes to secure one by the end of this year for its research department.

Greet Storms, Vice President of High-NA EUV Product Management at ASML, addressed concerns about the high price by stating, "We believe our clients understand the value proposition." She noted that all EUV clients have shown interest in the High-NA EUV technology during the R&D phase and have already placed orders. ASML aims to drive mass production by 2026, contingent on overall process costs and other considerations.

The High-NA EUV equipment began shipping at the end of last year and is expected to expose more than 185 wafers per hour, supporting the production of logic chips below 2nm and high-density memory chips. ASML highlights that the integration of High-NA EUV technology in advanced process chip manufacturing will streamline process steps, reduce the number of masks required, and improve production efficiency and yield. It is estimated that implementing EUV and High-NA EUV technologies will reduce energy consumption per wafer by approximately 200 kWh by 2029. According to ASML's 2023 annual report, energy consumption per wafer for EUV exposure has decreased by nearly 40% from 2018 to 2023, with a target reduction of an additional 30-35% by 2025.