TSMC Kaohsiung 2nm Fab Begins Equipment Installation

On November 26, TSMC held a low-key equipment installation ceremony for its first 2nm wafer fabrication plant in Kaohsiung. The internal event was not open to the public and was reportedly led by Y.P. Chyn, Senior Vice President and Co-Chief Operating Officer of TSMC. Guests included Kaohsiung Mayor Chen Chi-Mai and representatives from key industry partners.

During TSMC's October earnings call, Chairman and C.C. Wei highlighted strong customer interest in the 2nm process, surpassing expectations. To meet demand, TSMC plans to allocate more production capacity for 2nm compared to the 3nm node.

TSMC has previously emphasized that its 2nm technology development is progressing smoothly. Performance and yield rates are meeting or exceeding projections, and the technology is on track for volume production in 2025, following a ramp-up curve similar to 3nm.

According to industry sources, TSMC's 2nm production will be distributed across its Baoshan F20 facility in Hsinchu Science Park (HSP) and the Kaohsiung Nanzih F22 facility. The Baoshan plant is set to complete a small-scale trial production line by the end of 2024, with mass production scheduled for Q4 2025 and a monthly capacity of approximately 30,000 wafers. Meanwhile, the Kaohsiung F22 plant is expected to begin commercial production in Q1 2026, also with a monthly capacity of 30,000 wafers.