According to informed sources, Apple plans to begin using its own Bluetooth and Wi-Fi connectivity chips in its devices starting next year, gradually replacing certain components currently supplied by Broadcom. The new chip, codenamed "Proxima," has been in development for several years and is expected to be used in the first iPhones and smart home devices produced in 2025.
The report also notes that Apple's in-house chips will be manufactured by Taiwan Semiconductor Manufacturing Company (TSMC).
At its annual developer conference in June, Apple announced its intention to integrate its own server chips to enhance artificial intelligence (AI) capabilities in its devices.
This move marks a shift from Apple's strategy with Qualcomm, where the company moved to its own cellular modems. However, these two efforts are expected to complement each other in the future.
Earlier reports indicated that Apple is also collaborating with Broadcom to develop its first server chip, codenamed "Baltra," which is specifically designed for AI processing.
Despite efforts by Apple and other tech giants to reduce reliance on costly, scarce processors like those from Nvidia, there remain challenges in scaling AI services efficiently. Last year, Broadcom, a major supplier of wireless components to Apple, signed a multibillion-dollar agreement with Apple to develop 5G radio frequency components.