Apple M5 Series: N3P Process, Separate CPU/GPU Design

Apple is reportedly set to commence mass production of its next-generation M5 series chips in the second half of 2025, according to a report by Wccftech. These advanced chips will be integrated into Apple's Mac lineup and Apple Intelligence servers, promising significant advancements in performance and efficiency.

Renowned analyst Ming-Chi Kuo from TF International Securities recently shared insights in a Medium post, hinting at the development of higher-end versions of these chips. Additionally, Apple is expected to introduce its M4 Ultra chip next year, following a similar trajectory as the current M4 series.

Compared to the M4 series, the M5 series will deliver enhanced computational and graphical performance. While continuing to utilize TSMC's 3nm process, the M5 chips will adopt TSMC's more advanced N3P technology. This transition is expected to further boost performance, efficiency, and battery life in upcoming MacBook Pro and MacBook Air models.

Kuo also highlighted intriguing details about the M5 Pro and M5 Max chips, revealing that these chips will feature separate CPU and GPU designs. Apple appears to be moving away from its traditional system-on-chip (SoC) approach, where all components are integrated into a single package. Instead, the CPU and GPU for the M5 Pro and M5 Max chips will be designed separately.

This strategic shift is expected to enhance both computational and graphical capabilities while improving energy efficiency. By separating these components, Apple aims to optimize performance and achieve greater flexibility in chip design, aligning with the evolving demands of its hardware ecosystem.

The M series has been a cornerstone of Apple's hardware innovations, and the forthcoming M5 series demonstrates Apple's commitment to pushing the boundaries of computing technology. With the adoption of advanced processes and design methodologies, Apple is poised to further solidify its leadership in the semiconductor industry.