Apple Reportedly to Delay 2nm Adoption

Apple originally planned to integrate TSMC’s cutting-edge 2nm chips into the next-generation iPhone 17 Pro and Pro Max models. However, according to reports citing industry insiders, the high production costs and limited manufacturing capacity of TSMC's 2nm chips have led Apple to postpone their commercial application until 2026.

TSMC has begun trial production of 2nm chips at its Baoshan plant in Hsinchu, Taiwan, achieving a yield rate of approximately 60%. The manufacturing cost per wafer is estimated at an astonishing $30,000, making the adoption of 2nm chips in the iPhone 17 Pro series financially impractical.

As a result, Apple is reportedly pushing the deployment of 2nm chips by nearly a year, aligning their introduction with the anticipated 2026 release of the iPhone 18 Pro series. This decision suggests that the iPhone 17 Pro models will likely continue to use TSMC's 3nm chips.

At the IEDM 2024 conference, TSMC unveiled key advancements in its 2nm process. Compared to 3nm, the 2nm technology offers a 15% increase in transistor density, a 15% performance boost at equivalent power, and a power reduction of 24–35% at equivalent performance levels. Despite these advancements, 2nm remains in the early stages of development, with TSMC, Samsung Electronics, and Japan's Rapidus vying for leadership in this advanced semiconductor process.

To meet growing demand, TSMC is aggressively expanding its production capacity. The current monthly capacity for 2nm chips is around 10,000 wafers, with plans to increase this to 80,000 wafers per month by 2026 through significant facility investments. Meanwhile, TSMC is also ramping up its 3nm production capacity to solidify its position in advanced semiconductor manufacturing. The company aims to boost the output of its Arizona plant to approximately 140,000 wafers per month by expanding its equipment base.