Samsung Electronics said on Monday (30th) that Samsung Electronics Vice Chairman Lee Jae-yong met with Intel CEO Henry Kissinger. The prospect of cooperation between the two companies is promising amid the increasingly fierce competition in next-generation chip technology.
According to the "Korea Herald", Kissinger took a special plane to South Korea after attending the 2022 World Economic Forum (WEF) in Davos, Switzerland. Today, the world's semiconductor industry ranks first and second in sales. Business leaders held a meeting. The two sides discussed cooperation in various fields such as next-generation memory, system chips, wafers, personal computers and mobile devices.
Senior executives such as Kyung Kye-hyun, the co-representative director of Samsung Electronics in charge of the chip business, Roh Tae-moon, head of Samsung Electronics' mobile business unit, and executives from various chip business units such as memory chips, processors, and foundry also participated in the day's event. Meeting.
Intel returned to the chip-making business a year ago, and since then has spent tens of billions of dollars in total to restore its chip technology edge, including its latest $3 billion commitment to expand its chip operations in Oregon in April. factory.
Compared with Intel, Samsung Electronics can manufacture more advanced and smaller logic chips. Intel has long been aiming to break the 10nm barrier, and foundry rivals such as Samsung and TSMC have already achieved that.
At the same time, Samsung and Intel are also partners, because Samsung's memory chip modules and Intel's processors are usually installed on the same motherboard. Targeting DDR5 for PCs and servers and LPDDR6 for mobile phones, Samsung Electronics is seeking compatibility between memory chips and processors, and is also targeting new memory interfaces such as Computer Express Link.
According to reports, Kissinger began his Asia tour in April, visiting areas including Taiwan, China, where TSMC is located.