On July 17, TSMC Chairman and CEO Dr. C.C. Wei announced significant progress in the company's global manufacturing expansion during the latest earnings call. TSMC's second fabrication facility in the United States is now complete and will soon begin producing 3nm process nodes. Driven by strong customer demand, the company is expediting mass production schedules.
Additionally, TSMC's third U.S. fab is under construction, which will introduce 2nm and A16 technologies, with production timelines being accelerated to meet growing AI-related demands. A fourth fab will also feature 2nm and A16 processes, while the planned fifth and sixth facilities are set to deploy even more advanced technologies. Construction and production roadmaps for these fabs will align with customer requirements.
Dr. Wei highlighted that these strategic expansions will establish a high-capacity semiconductor cluster in Arizona, strengthening support for U.S. clients across smartphones, AI, and high-performance computing. TSMC is also planning to build two advanced packaging plants and an R&D center in the U.S. Once completed, approximately 30% of the company's 2nm and beyond capacities will be based in Arizona, forming a self-sufficient leading-edge semiconductor hub within the United States.
In Japan, TSMC's first specialty technology fab in Kumamoto began mass production by the end of 2024, achieving excellent yields. Construction of a second specialty technology facility is scheduled to begin later this year, contingent on the development of local infrastructure.
For Europe, Dr. Wei confirmed that TSMC has received strong support from the European Commission and German federal, state, and city governments. The company is progressing smoothly with plans to establish a specialty technology fab in Dresden, Germany, with production timelines tailored to market conditions and client demands.
In Taiwan, TSMC is set to build 11 new fabs and four advanced packaging facilities over the next several years. The company is preparing phased construction of 2nm process fabs in Hsinchu and Kaohsiung to meet the surge in structural demand from its global customer base.