TSMC N2P, A16 Progressing; A14 Set for 2028

At TSMC's Q2 earnings call on July 17, Chairman C.C. Wei shared a strong outlook for the third quarter, driven by robust demand for advanced process technologies. Wei highlighted that orders for TSMC's 2nm process in the first two years are projected to surpass the combined total of 3nm and 5nm in their respective early years, fueled by growth in smartphones and high-performance computing (HPC).

Regarding technology development, Wei affirmed that TSMC's N2 and A16 nodes maintain industry leadership in meeting HPC demands, with nearly all major innovators collaborating with the company. The N2 process remains on track for volume production in the second half of 2025. Additionally, TSMC is expanding its N2 family with the N2P variant, targeting enhanced performance and power efficiency, scheduled for mass production in late 2026.

The A16 technology will feature Super Power Rail (SPR) integration, optimizing designs that require complex signal routing and dense power delivery networks. A16 is expected to enter mass production in the second half of 2026.

For A14, TSMC is adopting a second-generation nanosheet transistor architecture to deliver superior performance and power efficiency for growing HPC applications. Wei noted that A14 development is progressing ahead of schedule in both component performance and yield improvement, with mass production planned for 2028.

TSMC also plans to reinforce the A14 platform with enhancements such as integrating SPR technology, slated for release in 2029. Wei expressed confidence that A14 and its derivatives will strengthen TSMC's technology leadership and capture future growth opportunities.

Addressing advanced packaging capacity, Wei emphasized continued strong demand for CoWoS solutions driven by AI applications. He reiterated that TSMC is committed to narrowing capacity gaps and will maintain a close watch on demand momentum.