Samsung Electronics plans to expand semiconductor packaging capacity

According to relevant reports, Samsung Electronics has begun to consider increasing investment in the semiconductor packaging business and is evaluating an investment plan that may expand production at its Cheonan plant in South Korea.

The report pointed out that Samsung Electronics' current semiconductor packaging capacity is mainly in Wenyang and Cheonan, Chungcheongnam-do, South Korea, and it also has a semiconductor packaging factory and R&D center in Suzhou. At present, Samsung may be renting the space of the Samsung Display Tianan factory, a subsidiary of the group, to expand production.

It is reported that in order to strengthen cooperation with large foundry customers in the packaging field, Samsung Electronics DS department established a semiconductor packaging task force (TF) in mid-June, which consists of DS department test and system packaging (TSP) engineers, semiconductor It consists of researchers at the R&D center and the head of the company's memory and wafer fabrication divisions, and is directly led by DS division CEO Kyung Kye-hyun.

As the miniaturization of circuits in the front-end process has reached its limit, "3D packaging" or "chiplet" technology is attracting investment from manufacturers. Data from market research agency Yole Development shows that in 2022, Intel and TSMC will respectively account for the global advanced packaging investment. 32% and 27%. Samsung ranks fourth, behind ASE in Taiwan.