TSMC Reportedly Sets 2nm Wafer Price at $30,000

The global race for 2nm process technology is accelerating. According to reports, TSMC has taken a bold step by setting its wafer price at around $30,000 each, applying a strict “no discounts, no negotiations” policy across all customers. This marks a 50%–66% jump compared to its current 3nm pricing.

Industry sources reveal that TSMC plans to begin trial production of 2nm within the next 3–4 years, starting with a monthly capacity of 30,000–35,000 wafers, which is expected to expand to 60,000 wafers per month by 2026 with four new fabs coming online. Early yield rates for logic chips are estimated at 60%, while SRAM yield could surpass 90%, making mass production viable.

The strategy behind the high pricing is not just about covering costs but maximizing profits by prioritizing limited capacity for high-end demand, particularly from HPC and AI markets. Major players such as Apple, NVIDIA, and AMD are seen as primary targets.

Meanwhile, Samsung is facing challenges with its 2nm process, with yields hovering around 40% and slower progress compared to TSMC. To rebuild confidence and win back customers, Samsung is adopting lower pricing and faster response strategies. However, its foundry division continues to post multi-trillion won quarterly losses, highlighting the urgency of securing large-scale clients.

Samsung is also working to strengthen trust in its 3nm GAA process and gain more traction among U.S. and European customers, which could pave the way for stronger momentum in its 2nm roadmap.